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3D Morphology

3D Surface Topography Measurement Platform

Features
Non-Contact, High-Precision 3D Surface Profiling
Wide field of view and high-efficiency scanning capability
Compatible with various materials and surface conditions
Comprehensive topography and surface feature analysis functions
Modular hardware/software architecture with open expansion interfaces
High stability design with strong vibration resistance
Broad applicability across diverse industrial and research fields

3D Surface Topography Measurement Platform

Color Confocal Single-Point Thickness and Warpage Measurement Technology

Color Confocal Technical Principle
  • Applicable to Glass and Silicon Substrates
  • Thickness measurement range: up to 0.7 mm
  • Measurement accuracy: < 2 μm; repeatability: < 2 μm
  • Supports multi-point thickness distribution and warpage inspection
Wafer Supports multi-point thickness distribution and warpage inspection 3D 翹曲分佈圖

iboson 3D Surface Analysis System

點雲資料處理 3D 資料重建處理 CAD 檔案比對

Non-Contact 3D Surface Reconstruction Technology

  • Capable of analyzing both glossy and matte surfaces
  • Enables high-precision dimensional analysis
  • Supports multi-layer thickness measurement
  • Allows evaluation of surface flatness and assembly tolerances
手機玻璃厚度疊層量測 Glass on Glass Glass on Plastic
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